NONCONTACT TEMPERATURE-MEASUREMENT IN SM COMPONENT REWORK


GEREN N.

JOURNAL OF ELECTRONICS MANUFACTURING, cilt.5, ss.129-136, 1995 (SCI İndekslerine Giren Dergi) identifier

  • Cilt numarası: 5 Konu: 2
  • Basım Tarihi: 1995
  • Doi Numarası: 10.1142/s0960313195000165
  • Dergi Adı: JOURNAL OF ELECTRONICS MANUFACTURING
  • Sayfa Sayıları: ss.129-136

Özet

Although surface mount assembly equipment has been rapidly developed during the last decade, surface mount device rework equipment is still largely basic and its development has not kept pace. The rework process is still viewed as a side issue, even when manufacturers consider the quality of the reworked board to be as good as the original board. An important consideration in rework is the control of the heating of the surface mount (SM) component, and although various attempts have been made to automate the heating process, the rework heating process is unfortunately still not as good and uniform as those for conventional SM reflow. Primarily, the techniques used for rework are manually assisted, and usually rely on the rework operator's judgement in the observation and control of the rework process.