Temperature rise during orthodontic bonding with various light-curing units - An in vitro study

Uzel A. , Buyukyilmaz T., Kayalioglu M., Uzel I.

ANGLE ORTHODONTIST, cilt.76, ss.330-334, 2006 (SCI İndekslerine Giren Dergi) identifier identifier identifier

  • Cilt numarası: 76 Konu: 2
  • Basım Tarihi: 2006
  • Sayfa Sayıları: ss.330-334


The purpose of this in vitro study was to investigate the temperature changes in the pulp chamber during bracket bonding using three different light sources. Bracket bonding was performed on one lower first premolar and one lower central incisor at two different distances (surface and 10 mm). The measurements were taken with a J-type thermocouple wire, placed in the pulp chamber and connected to a data logger. Analysis of variance revealed that pulp chamber temperature changes were influenced by the light source, the tooth type, and the distance from the tip of the light guide to the bracket surface. Halogen induced significantly higher intrapulpal temperature changes than light-emitting diode and Xenon Plasma Arc (PAC) (P =.000). The temperature increase was significantly higher when the light-guide tip was positioned at the surface of the teeth than at the 10-mm distance with all light-curing units (P =.000). All light-curing units produced higher intrapulpal temperature increase in the mandibular incisor than in the premolar. Power PAC produced significantly higher heat changes in the incisor than in the premolar. Orthodontic bonding with different light-curing units did not exceed the critical 5.5 degrees C value for pulpal health.