Electrochemical adsorption properties and inhibition of copper corrosion in chloride solutions by ascorbic acid: experimental and theoretical investigation


IONICS, vol.19, no.11, pp.1655-1662, 2013 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 19 Issue: 11
  • Publication Date: 2013
  • Doi Number: 10.1007/s11581-013-0902-5
  • Title of Journal : IONICS
  • Page Numbers: pp.1655-1662


In this study, the effect of ascorbic acid in the electrochemical behavior of copper has been investigated in 3.5 % NaCl solution using potentiodynamic polarization and electrochemical impedance spectroscopy. Current-potential curve and Nyquist diagrams were obtained in different concentrations of ascorbic acid. The surface morphology of copper after its exposure to 3.5 % NaCl solution with and without of ascorbic acid was examined by scanning electron microscopy. The obtained results show that ascorbic acid inhibits corrosion of copper in 3.5 % NaCl solution. The inhibition activity of ascorbic acid increases with a decrease in the concentration of ascorbic acid.