Electrochemical adsorption properties and inhibition of copper corrosion in chloride solutions by ascorbic acid: experimental and theoretical investigation

KILINÇÇEKER G., Celik S.

IONICS, vol.19, no.11, pp.1655-1662, 2013 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 19 Issue: 11
  • Publication Date: 2013
  • Doi Number: 10.1007/s11581-013-0902-5
  • Journal Name: IONICS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1655-1662
  • Keywords: Copper, Electrochemical techniques, Corrosion, Adsorption isotherm, PHOSPHATE IONS, ACETATE IONS, BEHAVIOR, IRON, SULFATE, BRASS
  • Çukurova University Affiliated: Yes

Abstract

In this study, the effect of ascorbic acid in the electrochemical behavior of copper has been investigated in 3.5 % NaCl solution using potentiodynamic polarization and electrochemical impedance spectroscopy. Current-potential curve and Nyquist diagrams were obtained in different concentrations of ascorbic acid. The surface morphology of copper after its exposure to 3.5 % NaCl solution with and without of ascorbic acid was examined by scanning electron microscopy. The obtained results show that ascorbic acid inhibits corrosion of copper in 3.5 % NaCl solution. The inhibition activity of ascorbic acid increases with a decrease in the concentration of ascorbic acid.