Designing behenic acid microcapsules as novel phase change material for thermal energy storage applications at medium temperature


ŞAHAN N., Paksoy H. Ö.

INTERNATIONAL JOURNAL OF ENERGY RESEARCH, cilt.44, sa.5, ss.3922-3933, 2020 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 44 Sayı: 5
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1002/er.5193
  • Dergi Adı: INTERNATIONAL JOURNAL OF ENERGY RESEARCH
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Agricultural & Environmental Science Database, Aquatic Science & Fisheries Abstracts (ASFA), Communication Abstracts, Compendex, Environment Index, INSPEC, Metadex, Pollution Abstracts, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.3922-3933
  • Anahtar Kelimeler: behenic acid, microcapsules, PCMs, TES, CHANGE MATERIALS PCMS, MICROENCAPSULATION, ENCAPSULATION, SHELL, PARAFFIN
  • Çukurova Üniversitesi Adresli: Evet

Özet

Fatty acids are bio-based materials that can be used as phase change materials (PCMs). Microencapsulation of low carbon number fatty acids for mainly building applications have been realized in previous studies. In this study, behenic acid (BA), a fatty acid with medium melting range (65 degrees C-85 degrees C), has been microencapsulated for the first time. PMMA and its three copolymers were used as shell material of these novel encapsulated PCMs prepared by emulsion polymerization technique. The influences of using different comonomers in shell materials on the thermal, morphological, and chemical properties were investigated. Melting phase change temperature ranges were found as 65 degrees C to 85 degrees C for all capsule candidates. Capsules had uniform spherical geometry with size ranges under 500 nm. The capsules are suggested as novel PCM candidates in this temperature range that has potential applications in industrial waste heat, electronics, solar residential heating, lithium-ion batteries, and automotive application.